Postdoctoral Fellow / Process Engineer in Gold electroplating for X-ray gratings microfabrication in Zürich

The is committed to advancing the clinical translation of gratings-based X-ray interferometry, working closely with our industrial partners. This revolutionary technology relies on the development of state-of-the-art X-ray optics using the latest micro- and nano fabrication techniques.

We are currently seeking a highly motivated postdoctoral fellow / process engineer to join our grating fabrication team. As a member of our multidisciplinary team of academic and industry researchers, you will have the opportunity to contribute to the ongoing advancement of this cutting-edge technology.

As a valued team member, your primary responsibility will be to support the development of the microfabrication process for hard X-ray gratings suitable for preclinical testing, in close collaboration with our spin-off company, . Specifically, you will focus on the development of customized electrochemical processing, including Au pulsed electrodeposition, damascene, and bottom-up superfilling Au electroplating, in partnership with our industry partners.

Your duties will include:

• Managing and maintaining our electrochemical equipment;
• Conducting Au electroplating tasks on the provided silicon templates for various projects;
• Optimizing and scaling up Au electroplating for gratings at the wafer scale, ranging from 1 cm2 to 100 cm2;
• Preparing samples for inspection by optical microscope, SEM, and X-ray interferometry;
• Documenting processing activities and writing reports to communicate progress and results.

We are seeking a highly motivated and enthusiastic individual who demonstrates a positive, service-oriented doer attitude, and great team spirit to join our team. As a valued member, you will collaborate with others on their projects to achieve our goals.

Qualifications:

• A PhD and/or master's degree in Chemistry, Chemical Engineering, or Materials Science with demonstrated expertise in applied electrochemistry.
• Proven hands-on experience in setting up and maintaining electrochemistry equipment, processes, and various metrology methods associated with the control and monitoring of such processes.
• Previous experience in one or more of the following areas is desirable: Au electrodeposition, electroless deposition, development of 3D metallic structures, electrodeposition process for three-dimensional packaging including TSV process, design deposition bath containing appropriate additives and fabricate metallic filled deep vias on silicon wafer, and the use of analytical techniques such as cyclic voltammetry and chronoamperometry.
• Strong analytical thinking skills and the ability to handle multiple tasks in parallel are required, along with a good aptitude for teamwork.
• Ability to work under project deadline pressure.
• Strong communication skills in spoken and written English are a must.

Our organization operates on the principles of interdisciplinary collaboration, innovation, and dynamism. As a valued member of our team, you can expect to receive comprehensive on-the-job training, as well as access to various personal and professional development opportunities. Additionally, we foster a strong culture of vocational training, which will enable you to enhance your skillset and advance your career.

We recognize the importance of achieving a healthy work-life balance, and as such, we offer modern employment conditions and on-site infrastructure to support you in optimizing your schedule to accommodate your personal interests and family commitments.

It is important to note that your employment contract will be limited to a duration of two years.